VLSI Technology LLC v. Intel Corp., No. 21-1826 (Fed. Cir. 2022)
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VLSI sued Intel for infringing a patent, directed to “[a] technique for alleviating the problems of defects caused by stress applied to bond pads” of an integrated circuit. The district court construed the term “force region,” which appears in two independent claims, to mean a “region within the integrated circuit in which forces are exerted on the interconnect structure when a die attach is performed.” In the meantime, Intel sought inter partes review (IPR), and proposed the construction of “force region,” consistent with the construction that the district court adopted. The parties disagreed as to the meaning of the term “die attach.” In its Institution Decisions, the Patent Trial and Appeal Board stated that it disagreed with VLSI that the method of performing a “die attach” cannot include the method of wire bonding. In its Final Decision, the Board did not resolve the meaning of “die attach” but construed the term “force region” as “including at least the area directly under the bond pad.” The Board found that the patent specification made clear that the term “force region” was not limited to flip chip bonding, but could include wire bonding and concluded that the challenged claims were unpatentable for obviousness.
The Federal Circuit affirmed the Board’s treatment of the “force region” limitation but held that the Board erred in construing the phrase “used for electrical interconnection” to encompass a metallic structure that is not connected to active circuitry.
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