2005 Connecticut Code - Sec. 10-287d. Bond issue for school building project grants.
Sec. 10-287d. Bond issue for school building project grants. For the purposes of
funding (1) grants to projects that have received approval of the State Board of Education
pursuant to sections 10-287 and 10-287a, subsection (a) of section 10-65 and section
10-76e, (2) grants to assist school building projects to remedy safety and health violations and damage from fire and catastrophe, and (3) regional vocational-technical school
projects pursuant to section 10-283b, the State Treasurer is authorized and directed,
subject to and in accordance with the provisions of section 3-20, to issue bonds of the
state from time to time in one or more series in an aggregate amount not exceeding four
billion one hundred seventy-one million eight hundred sixty thousand dollars, provided
six hundred twenty-five million five hundred thousand dollars of said authorization shall
be effective July 1, 2004. Bonds of each series shall bear such date or dates and mature
at such time or times not exceeding thirty years from their respective dates and be subject
to such redemption privileges, with or without premium, as may be fixed by the State
Bond Commission. They shall be sold at not less than par and accrued interest and the
full faith and credit of the state is pledged for the payment of the interest thereon and
the principal thereof as the same shall become due, and accordingly and as part of the
contract of the state with the holders of said bonds, appropriation of all amounts necessary for punctual payment of such principal and interest is hereby made, and the State
Treasurer shall pay such principal and interest as the same become due. The State Treasurer is authorized to invest temporarily in direct obligations of the United States, United
States agency obligations, certificates of deposit, commercial paper or bank acceptances
such portion of the proceeds of such bonds or of any notes issued in anticipation thereof
as may be deemed available for such purpose.
History: 1971 acts changed bond limit from one hundred sixty million to two hundred forty-one million seven hundred fifty-five thousand dollars, deleted reference to Sec. 10-287 and to repealed Sec. 10-287b and further increased limit to three hundred sixteen million seven hundred fifty-five thousand dollars in June session; 1972 act included references to Subdiv. (a) of Sec. 10-65 and to Sec. 10-76e and increased bond limit to three hundred ninety-three million eight hundred eighty thousand dollars; P.A. 73-286 increased limit to four hundred thirteen million eight hundred eighty thousand dollars; P.A. 76-418 included in provisions authorization for grants to remedy safety and health violations and damage from fire and catastrophe, required appropriation of amounts necessary to make punctual payments in contracts between state and bondholders and increased limit to five hundred four million dollars; P.A. 79-591 increased limit to five hundred nine million dollars; P.A. 80-317 specified authorization for grants for projects whose final plans and specifications were approved before January 1, 1980, pursuant to sections enumerated; S.A. 80-41 increased limit to five hundred fourteen million dollars; P.A. 84-443 decreased authorization limit to five hundred eleven million dollars; P.A. 87-405 decreased the bond authorization from five hundred eleven million dollars to five hundred ten million dollars; P.A. 88-343 removed the January 1, 1980 ending date and increased the bond authorization from five hundred ten million dollars to five hundred forty-eight million dollars; P.A. 89-1 authorized the state treasurer to issue bonds for the purposes of grants for projects approved pursuant to Sec. 10-287; P.A. 89-331 increased the bond authorization from five hundred forty-eight million dollars to five hundred eighty-six million dollars; P.A. 90-297 increased the bond authorization from five hundred eighty-six million dollars to six hundred fifty-nine million dollars; June Sp. Sess. P.A. 91-4 increased the bond authorization from six hundred fifty-nine million dollars to eight hundred seven million dollars; May Sp. Sess. P.A. 92-7 increased the bond authorization from eight hundred seven million dollars to nine hundred nineteen million dollars; June Sp. Sess. P.A. 93-1 increased bond authorization from nine hundred nineteen million dollars to one billion one hundred eighty-six million one hundred thousand dollars, effective July 1, 1993, provided one hundred thirty-eight million dollars of said authorization shall be effective July 1, 1994; P.A. 95-272 increased authorization amount from one billion one hundred eighty-six million one hundred thousand dollars to one billion four hundred forty-six million one hundred thousand dollars, effective July 1, 1995, provided thirty million dollars shall be effective July 1, 1996; P.A. 97-265 increased the cap for bonding and the amount of authorization that shall be effective July 1, 1998, effective July 1, 1997; P.A. 98-259, effective July 1, 1998, increased authorization from $1,699,560,000 to $1,749,560,000 provided $184,810,000 of said authorization is effective July 1, 1998; P.A. 99-4 increased authorization from $1,749,560,000 to $1,801,560,000, effective April 9, 1999; P.A. 99-241 increased authorization from 1,801,560,000 to $2,511,360,000, effective July 1, 1999, provided $339,000,000 is effective July 1, 2000; P.A. 99-281 designated existing provisions as Subdivs. (1) and (2) and added Subdiv. (3) re regional vocational-technical school projects, effective July 1, 1999; P.A. 00-167 increased the aggregate bond authorization from $2,511,360,000 to $2,565,360,000, effective July 1, 2000, of which $393,000,000 is effective July 1, 2000; June Sp. Sess. P.A. 01-7 increased authorization from $2,565,360,000 to $3,158,360,000 provided $450,000,000 is effective July 1, 2002, effective July 1, 2001; May 9 Sp. Sess. P.A. 02-5 decreased the aggregate bond authorization from $3,158,360,000 to $3,108,360,000, effective July 1, 2002, of which $20,000,000 is effective July 1, 2003; Sept. 8 Sp. Sess. P.A. 03-2 increased the aggregate bond authorization from $3,108,360,000 to $3,546,360,000, effective September 10, 2003, of which $458,000,000 is effective July 1, 2003; May Sp. Sess. P.A. 04-1 increased the aggregate authorization to $4,171,860,000 and provided that $625,500,000 of said authorization is effective July 1, 2004, effective July 1, 2004.
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